Special Session 2
Special Session 2: RF and Millimeter-Wave Integrated Circuit Design
Description:
With the rapid development of 5G/6G wireless communication and intelligent sensing systems, radio frequency (RF) and millimeter-wave integrated circuits require synergistic optimization of performance, energy efficiency, system integration, and intelligence to meet the diverse demands of communication, sensing, and intelligent terminal applications. This special session focuses on advanced circuit designs and system solutions in the RF and millimeter-wave fields, covering low-power wireless transceivers, 5G/6G communication chips, heterogeneous integration technology, phased-array and beamforming systems, power management, high-speed interfaces, and AI-assisted chip design.
Session organizers
Dr. Cesar Diaz-Londono, Huanjiang Laboratory, China
Dr. Hamidreza Arasteh, Huanjiang Laboratory, China
Dr. Anand R., Huanjiang Laboratory, China
Prof. Sanjeevikumar Padmanaban, University of South-Eastern Norway, Norway
The topics of interest include, but are not limited to:
- RF circuits and wireless systems
- Silicon-based millimeter-wave integrated circuit design
- Silicon/GaN heterogeneous integration circuit design
- Millimeter-wave phased arrays and beamforming technologies
- Efficient power management and energy management ICs
- High-speed interface and communication chips
- AI-enabled intelligent sensing chips
Submission method
Submit your Full Paper (no less than 5 pages with two colums) or your paper abstract-without publication (200-400 words) via Online Submission System, then choose Special Session 2 (RF and Millimeter-Wave Integrated Circuit Design)
Session Organizers' Biography:
Prof. Keping Wang
Tianjin University, China
Keping Wang is a chair professor and Ph.D. supervisor at Tianjin University. His research interests include wireless SoC integrated circuits for artificial intelligence of things, silicon-based analog/RF/millimeter-wave integrated circuits for 6G applications, and analog integrated circuits and systems for brain-computer interface. He has led several national-level research projects, including projects supported by the National Key Research and Development Program of China, Joint Key Projects and General Program Projects of the National Natural Science Foundation of China (NSFC), and other national research initiatives. He authored or coauthored over 100 international journal and conference papers in the field of integrated circuits, including over 70 papers in IEEE core journals/conference papers such as ISSCC, JSSC, TMTT, TCAS-I, CICC, and RFIC, and has been granted over 20 invention patents; he has also authored 2 English monographs (chapters). He serves as Vice Chair of the IEEE Tianjin AP/MTT/SSC Joint Chapter, Associate editor of IEEE TCAS-II, Regional Editor of MOTL, editorial board member of Microelectronics Journal, and editorial board member of Solid State Electronics Research and Progress. (Email: kpwang@tju.edu.cn)
Prof. Kai Tang
Tianjin University, China
Kai Tang is a professor and Ph.D. supervisor at the School of Electrical and Information Engineering, Hunan University. He currently serves as the Vice Dean of the School of Electrical and Information Engineering and the Director of the Department of Electronic Science and Technology. He is a recipient of the National-Level Overseas Young Talent Program, the Hunan Province Furong Young Talent Program, and the Yuelu Scholar Program of Hunan University. He has more than 10 years of research experience in RF and analog integrated circuits, mixed-signal processing, and advanced IC design technologies. His research interests mainly include fully integrated low-power radar transceiver systems, low-power analog and RF integrated circuits, CMOS-MEMS co-design, and high-speed signal processing circuits. He authored or coauthored over 80 high-level journal and conference papers in the fields of integrated circuits and systems and has been granted 1 invention patent. (Email: ktang@hnu.edu.cn)
Dr. Zongle Ma
Tianjin University, China
Zongle Ma is a Ph.D. candidate at the School of Microelectronics, Tianjin University. Her research interests focus on low-power miniaturized receiver integrated circuit chips for artificial intelligence of things. She was selected for the “PhD Student Initiative Program” of the IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications and received “second prize” in the China Postgraduate Chip Innovation Competition. She authored or coauthored 24 international journal and conference papers, including 7 papers in IEEE core journals/conferences such as JSSC, TCAS-I, ASSCC, and RFIC, and has been granted 1 invention patent. She serves as a reviewer for the Microelectronics Journal. (Email: zlma@tju.edu.cn)